SEI Laser PAPER BLASTER 02SEI Laser
PAPER BLASTER 02
SEI Laser PAPER BLASTER 02
SEI Laser
PAPER BLASTER 02
سال ساخت
۲۰۰۸
وضعیت
کارکرده
موقعیت
لهستان 

اطلاعات پایه
- نام دستگاه:
- SEI Laser PAPER BLASTER 02
- تولید کننده:
- SEI Laser
- مدل:
- PAPER BLASTER 02
- سال ساخت:
- ۲۰۰۸
- وضعیت:
- آماده به کار (دست دوم)
قیمت و مکان
- موقعیت:
- , لهستان

تماس بگیرید
جزئیات فنی
لیزر
توان لیزر:
۱۱۵٬۰۰۰ وات
جزئیات بیشتر
تعداد محور:
۳
جزئیات پیشنهاد
- شناسه آگهی:
- A22840980
- شماره مرجع:
- PL-CUT-SEI-2008-00001
- بهروزرسانی:
- آخرین بهروزرسانی در ۲۰.۰۷.۱۴۰۵
توضیحات
CO2 laser cutting machine manufactured in 2008. This SEI Laser Paper Blaster 02 features a sealed CO₂ laser with a nominal power of 115 W, designed for paper and cardboard processing. It includes an automatic sheet feeder with a maximum stack height of 350 mm and an integrated conveyor system for efficient operation. If you are looking to get high-quality cutting, marking, and engraving capabilities, consider the SEI Laser Paper Blaster 02 machine we have for sale. Contact us for further details.
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
Gedsz Hbyyepfx Aaxeui
• Machine nameplate current: 1 A
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
Gedsz Hbyyepfx Aaxeui
• Machine nameplate current: 1 A
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