Assembling machine

Datacon 2200 evo advanced 2200 evo

Key Features
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Accuracy
± 3µm at 3s placement accuracy
± 0.07° at 3s rotational accuracy
New vision, optics, and camera system
Various configurable (FOV & resolution) sets of cameras
3D & contactless height measurement options

Multi-chip
Max. 14 different pick-up tools/nozzles
5 eject tools
3 different epoxies/adhesives in a single pass
Any flip chip/face-up die combination
Dual module for even higher productivity (option)

Bonding
0.5 - 25N closed-loop bond force
0-360° bond rotation
Heated bond head (max. 450°C) (option)
UV curing with up to 2,000mW/cm2 (365 / 405nm) (option)

Dispensing
High-end auger pump
Time-pressure dispensing
Piezo jetter valves
Pin transfer
Automatic epoxy volume control

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